This application note demonstrates how VersaSCAN uses Optical Surface Profiler (OSP) topography data to perform height-tracked Scanning Kelvin Probe (SKP) measurements on rough and uneven surfaces. By mapping surface topography prior to electrochemical analysis, the system maintains a constant probe-to-sample distance, minimizing topography-induced measurement artifacts and enabling accurate characterization of surface electrochemical properties. Using a welded aluminum sample with approximately 1.6 mm height variation as an example, the note outlines the workflow for OSP mapping, scan alignment, and height-tracked SKP measurements. The approach can also be applied to SECM, AC-SECM, SVET, and LEIS techniques.
Download the application note